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1 Ergebnisse
1
Chemical bonding copper and epoxy through self-assembled la..:
, In:
2022 International Conference on Electronics Packaging (ICEP)
,
Zhao, Shuaijie
;
Chen, Chuantong
;
Ueshima, Minoru
.. - p. 123-124 , 2022
Link:
https://doi.org/10.23919/ICEP55381.2022.9795526
RT T1 <cTitle>2022 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Chemical bonding copper and epoxy through self-assembled layer</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9795526&Exemplar=1&LAN=DE A1 Zhao, Shuaijie A1 Chen, Chuantong A1 Ueshima, Minoru A1 Haga, Motoharu A1 Suganuma, Katsuaki YR 2022 K1 Surface resistance K1 Surface roughness K1 Rough surfaces K1 Delays K1 Copper K1 Bonding K1 Surface treatment K1 copper-epoxy bond K1 self-assembled layers K1 chemical bonding K1 copper thiolate complexes SP 123 OP 124 LK http://dx.doi.org/https://doi.org/10.23919/ICEP55381.2022.9795526 DO https://doi.org/10.23919/ICEP55381.2022.9795526 SF ELIB - SuUB Bremen
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