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1 Ergebnisse
1
Sn-based solder design using machine learning approach:
, In:
2022 International Conference on Electronics Packaging (ICEP)
,
Liu, Yu-Chen
;
Yang, Chih-Han
;
Lin, Shih-Kang
- p. 43-44 , 2022
Link:
https://doi.org/10.23919/ICEP55381.2022.9795569
RT T1
2022 International Conference on Electronics Packaging (ICEP)
: T1
Sn-based solder design using machine learning approach
UL https://suche.suub.uni-bremen.de/peid=ieee-9795569&Exemplar=1&LAN=DE A1 Liu, Yu-Chen A1 Yang, Chih-Han A1 Lin, Shih-Kang YR 2022 K1 Electric potential K1 Metals K1 Machine learning K1 Electronics packaging K1 Sn-based solder K1 hardness K1 machine learning SP 43 OP 44 LK http://dx.doi.org/https://doi.org/10.23919/ICEP55381.2022.9795569 DO https://doi.org/10.23919/ICEP55381.2022.9795569 SF ELIB - SuUB Bremen
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