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1 Ergebnisse
1
Mechanical properties of Sn-Bi-Ag low-temperature Pb-free s..:
, In:
2022 International Conference on Electronics Packaging (ICEP)
,
Yang, Chih-Han
;
Liu, Yu-Chen
;
Hirata, Yuki
.. - p. 37-38 , 2022
Link:
https://doi.org/10.23919/ICEP55381.2022.9795572
RT T1 <cTitle>2022 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Mechanical properties of Sn-Bi-Ag low-temperature Pb-free solders</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9795572&Exemplar=1&LAN=DE A1 Yang, Chih-Han A1 Liu, Yu-Chen A1 Hirata, Yuki A1 Nishikawa, Hiroshi A1 Lin, Shih-Kang YR 2022 K1 Thermodynamics K1 Temperature K1 Bismuth K1 Aging K1 Electronic packaging thermal management K1 Software K1 Mechanical factors K1 Sn-Bi-Ag K1 CALPHAD K1 Low-temperature solder SP 37 OP 38 LK http://dx.doi.org/https://doi.org/10.23919/ICEP55381.2022.9795572 DO https://doi.org/10.23919/ICEP55381.2022.9795572 SF ELIB - SuUB Bremen
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