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1 Ergebnisse
1
Voids in First-Level Interconnects and Their Impact on Sold..:
, In:
2022 International Conference on Electronics Packaging (ICEP)
,
Lee, Kor Oon
;
Oi, Kiyoshi
;
Lim, Sze Pei
... - p. 5-6 , 2022
Link:
https://doi.org/10.23919/ICEP55381.2022.9795574
RT T1 <cTitle>2022 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Voids in First-Level Interconnects and Their Impact on Solder Joint Reliability</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9795574&Exemplar=1&LAN=DE A1 Lee, Kor Oon A1 Oi, Kiyoshi A1 Lim, Sze Pei A1 Yeo, Yvonne A1 Sweatman, Keith A1 Ono, Toshiaki A1 Murayama, Kei A1 Martell, Steven R. A1 Shimamoto, Haruo A1 Tsuriya, Masahiro YR 2022 K1 Electromigration K1 Electric shock K1 Thermal shock K1 Inspection K1 Electronic packaging thermal management K1 Reliability K1 Soldering K1 voids K1 first-level interconnects K1 electromigration K1 thermal cycle K1 thermal shock SP 5 OP 6 LK http://dx.doi.org/https://doi.org/10.23919/ICEP55381.2022.9795574 DO https://doi.org/10.23919/ICEP55381.2022.9795574 SF ELIB - SuUB Bremen
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