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1 Ergebnisse
1
Low temperature interconnects in 1st level packaging and it..:
, In:
2022 International Conference on Electronics Packaging (ICEP)
,
Arvin, Charles
;
Lim, Sze Pei
;
Locker, David
... - p. 7-8 , 2022
Link:
https://doi.org/10.23919/ICEP55381.2022.9795576
RT T1 <cTitle>2022 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Low temperature interconnects in 1st level packaging and its challenges</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9795576&Exemplar=1&LAN=DE A1 Arvin, Charles A1 Lim, Sze Pei A1 Locker, David A1 Loh, Wei Keat A1 Sweatman, Keith A1 Lee, Francis A1 Tsuriya, Masahiro YR 2022 K1 Temperature sensors K1 Temperature K1 Integrated circuit interconnections K1 Tin K1 Packaging K1 Reliability K1 Intermetallic K1 First level Interconnects K1 Low Temperature Bonding K1 IC Package Reliability SP 7 OP 8 LK http://dx.doi.org/https://doi.org/10.23919/ICEP55381.2022.9795576 DO https://doi.org/10.23919/ICEP55381.2022.9795576 SF ELIB - SuUB Bremen
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