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1 Ergebnisse
1
Low temperature Cu/SiO2 hybrid bonding fabricated by 2-step..:
, In:
2022 International Conference on Electronics Packaging (ICEP)
,
Ong, Jia-Juen
;
Chiu, Wei-Lan
;
Lee, Ou-Hsiang
.. - p. 135-136 , 2022
Link:
https://doi.org/10.23919/ICEP55381.2022.9795579
RT T1 <cTitle>2022 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Low temperature Cu/SiO2 hybrid bonding fabricated by 2-step process</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9795579&Exemplar=1&LAN=DE A1 Ong, Jia-Juen A1 Chiu, Wei-Lan A1 Lee, Ou-Hsiang A1 Chang, Hsiang-Hung A1 Chen, Chih YR 2022 K1 Temperature measurement K1 Silicon compounds K1 Annealing K1 Force K1 Metals K1 Plasmas K1 Integrated circuit packaging K1 Cu/SiO2 hybrid bonding K1 flip chip bonding3-D ICs packaging technology K1 highly-(111) oriented nanotwinned Cu SP 135 OP 136 LK http://dx.doi.org/https://doi.org/10.23919/ICEP55381.2022.9795579 DO https://doi.org/10.23919/ICEP55381.2022.9795579 SF ELIB - SuUB Bremen
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