I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Characteristic Analysis of a Multi-chip Embedded Interposer..:
, In:
2022 International Conference on Electronics Packaging (ICEP)
,
Lee, Ching Kuan
;
Liu, Wen-Hung
;
Chang, Shu-Yi
... - p. 55-56 , 2022
Link:
https://doi.org/10.23919/ICEP55381.2022.9795583
RT T1 <cTitle>2022 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Characteristic Analysis of a Multi-chip Embedded Interposer Carrier using a Wafer-Level Fan-Out Process</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9795583&Exemplar=1&LAN=DE A1 Lee, Ching Kuan A1 Liu, Wen-Hung A1 Chang, Shu-Yi A1 Cheng, Ren-Shin A1 Lin, Yu-Min A1 Ding, Hsiang-En A1 Chiu, Wei-Lan A1 Chang, Tao-Chih A1 Lee, Chia-Hsin A1 Lee, Chang-Chun YR 2022 K1 Semiconductor device modeling K1 Time-frequency analysis K1 Semiconductor device measurement K1 Three-dimensional displays K1 Packaging K1 Length measurement K1 Frequency measurement K1 Embedded Interposer Carrier K1 fan-out process K1 multichip SP 55 OP 56 LK http://dx.doi.org/https://doi.org/10.23919/ICEP55381.2022.9795583 DO https://doi.org/10.23919/ICEP55381.2022.9795583 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
