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1 Ergebnisse
1
Cu-Sintering on Organic Packages for Power Modules:
, In:
2022 International Conference on Electronics Packaging (ICEP)
,
Hans-Jurgen, Albrecht
;
Dirk, Busse
;
Alexander, Dahlbudding
... - p. 151-152 , 2022
Link:
https://doi.org/10.23919/ICEP55381.2022.9795592
RT T1 <cTitle>2022 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Cu-Sintering on Organic Packages for Power Modules</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9795592&Exemplar=1&LAN=DE A1 Hans-Jurgen, Albrecht A1 Dirk, Busse A1 Alexander, Dahlbudding A1 Aaron, Hutzler A1 Olaf, Ramer A1 Ichiro, Ota A1 Hideo, Nakako A1 Florian, Pape A1 Dewi, Nilasari YR 2022 K1 Silicon carbide K1 Force K1 Multichip modules K1 Materials reliability K1 Silicon K1 Bonding K1 Substrates K1 Cu sinter paste K1 SiC K1 organic substrates K1 sintering K1 reliability SP 151 OP 152 LK http://dx.doi.org/https://doi.org/10.23919/ICEP55381.2022.9795592 DO https://doi.org/10.23919/ICEP55381.2022.9795592 SF ELIB - SuUB Bremen
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