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1 Ergebnisse
1
A Drop-In High-Temperature Lead-Free Solder Paste that Outp..:
, In:
2022 International Conference on Electronics Packaging (ICEP)
,
Zhang, Hongwen
;
Lim, Sze Pei
;
Lytwynec, Samuel
.. - p. 69-70 , 2022
Link:
https://doi.org/10.23919/ICEP55381.2022.9795597
RT T1 <cTitle>2022 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>A Drop-In High-Temperature Lead-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9795597&Exemplar=1&LAN=DE A1 Zhang, Hongwen A1 Lim, Sze Pei A1 Lytwynec, Samuel A1 Richmond, Tyler A1 Harter, Tybarius YR 2022 K1 Resistance K1 Powders K1 Sensitivity K1 Morphology K1 Moisture K1 Production K1 Lead K1 lead-free solder K1 power discrete K1 die-attach SP 69 OP 70 LK http://dx.doi.org/https://doi.org/10.23919/ICEP55381.2022.9795597 DO https://doi.org/10.23919/ICEP55381.2022.9795597 SF ELIB - SuUB Bremen
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