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1 Ergebnisse
1
Environmental Reliability Evaluation of the Ultrasonic Bond..:
, In:
2022 International Conference on Electronics Packaging (ICEP)
,
Noh, Taejoon
;
Kim, Kyung-Yeol
;
Kang, Dong-Gil
. - p. 51-52 , 2022
Link:
https://doi.org/10.23919/ICEP55381.2022.9795607
RT T1 <cTitle>2022 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Environmental Reliability Evaluation of the Ultrasonic Bonded Metal with High- Temperature Test</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9795607&Exemplar=1&LAN=DE A1 Noh, Taejoon A1 Kim, Kyung-Yeol A1 Kang, Dong-Gil A1 Jung, Seung-Boo YR 2022 K1 Temperature measurement K1 Semiconductor device measurement K1 Ultrasonic variables measurement K1 Acoustics K1 Nickel K1 Reliability K1 Intermetallic K1 High-Temperature Test K1 Shear Strength K1 Ultrasonic SP 51 OP 52 LK http://dx.doi.org/https://doi.org/10.23919/ICEP55381.2022.9795607 DO https://doi.org/10.23919/ICEP55381.2022.9795607 SF ELIB - SuUB Bremen
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