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1 Ergebnisse
1
3D X-Ray Microscope Applied on Fine-Line Inspection of Fan-..:
, In:
2022 International Conference on Electronics Packaging (ICEP)
,
Liu, Cheng-Hsin
;
Chang, Yu-Jen
;
Hsiao, Yu-Hsiang
. - p. 199-200 , 2022
Link:
https://doi.org/10.23919/ICEP55381.2022.9795636
RT T1 <cTitle>2022 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>3D X-Ray Microscope Applied on Fine-Line Inspection of Fan-Out Packages</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9795636&Exemplar=1&LAN=DE A1 Liu, Cheng-Hsin A1 Chang, Yu-Jen A1 Hsiao, Yu-Hsiang A1 Lin, Yi-Sheng YR 2022 K1 Image segmentation K1 Electric potential K1 Three-dimensional displays K1 Image resolution K1 Microscopy K1 Failure analysis K1 Inspection K1 Fine-Line K1 Fan-Out K1 3D X-Ray K1 Failure Analysis SP 199 OP 200 LK http://dx.doi.org/https://doi.org/10.23919/ICEP55381.2022.9795636 DO https://doi.org/10.23919/ICEP55381.2022.9795636 SF ELIB - SuUB Bremen
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