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1 Ergebnisse
1
Fine Pitch Circuit Pattern Inspection Capability Study for ..:
, In:
2022 International Conference on Electronics Packaging (ICEP)
,
Xue, Feng
;
Zou, Zhihua
;
Reynolds, Charles
... - p. 1-2 , 2022
Link:
https://doi.org/10.23919/ICEP55381.2022.9795644
RT T1 <cTitle>2022 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Fine Pitch Circuit Pattern Inspection Capability Study for Fan-out Wafer/Panel Level Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9795644&Exemplar=1&LAN=DE A1 Xue, Feng A1 Zou, Zhihua A1 Reynolds, Charles A1 Wassick, Tom A1 Pomerantz, Glenn A1 Santos, Anna Lucy A1 Tang, Neil A1 Lin, Alison Yu-Ting A1 Huang, Jing-Sian A1 Tsuriya, Masahiro YR 2022 K1 Integrated optics K1 TV K1 Optical design K1 Image edge detection K1 Bandwidth K1 Packaging K1 Feature extraction K1 AOI K1 Defect Detection K1 Fine Pitch Patterns K1 Nick(Mouse-bite) and Protrusion K1 Advanced Packages SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.23919/ICEP55381.2022.9795644 DO https://doi.org/10.23919/ICEP55381.2022.9795644 SF ELIB - SuUB Bremen
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