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1 Ergebnisse
1
New Method for BEOL Overlay and Process Margin Characteriza..:
, In:
2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
,
Yang, Linrong
;
Li, Runling
;
Ren, Jiadong
... - p. 138-140 , 2022
Link:
https://doi.org/10.1109/EDTM53872.2022.9798109
RT T1 <cTitle>2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)</cTitle>: T1 <Title>New Method for BEOL Overlay and Process Margin Characterization</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9798109&Exemplar=1&LAN=DE A1 Yang, Linrong A1 Li, Runling A1 Ren, Jiadong A1 Sun, Linlin A1 Xue, Yawen A1 Yang, Wenchao A1 Zhang, Ruilin A1 Zhu, Yefang A1 Zhang, Yan A1 Hsu, Ikai A1 Zhang, Haiqiong A1 Zhang, Guifeng A1 Fu, Yingying A1 Yin, Shan A1 Jia, Yujie A1 Yu, Bo A1 Brozek, Tomasz YR 2022 K1 Voltage measurement K1 Metals K1 Color K1 Metrology K1 Manufacturing K1 Reliability K1 Monitoring K1 BEOL K1 LELE K1 Overlay K1 Process Margin K1 Design for Inspection K1 Voltage Contrast SP 138 OP 140 LK http://dx.doi.org/https://doi.org/10.1109/EDTM53872.2022.9798109 DO https://doi.org/10.1109/EDTM53872.2022.9798109 SF ELIB - SuUB Bremen
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