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1 Ergebnisse
1
Prediction and Process Control Technique of Wafer Warpage f..:
, In:
2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
,
Kato, Hiroaki
;
Nishiguchi, Toshifumi
;
Shimomura, Saya
.. - p. 27-29 , 2022
Link:
https://doi.org/10.1109/EDTM53872.2022.9798171
RT T1
2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
: T1
Prediction and Process Control Technique of Wafer Warpage for Advanced Trench Field Plate Power MOSFETs
UL https://suche.suub.uni-bremen.de/peid=ieee-9798171&Exemplar=1&LAN=DE A1 Kato, Hiroaki A1 Nishiguchi, Toshifumi A1 Shimomura, Saya A1 Miyashita, Katsura A1 Kobayashi, Kenya YR 2022 K1 Semiconductor device modeling K1 Correlation K1 Manufacturing processes K1 Process control K1 Quality control K1 Predictive models K1 Oxidation K1 Field-plate K1 MOSFET K1 Wafer warpage SP 27 OP 29 LK http://dx.doi.org/https://doi.org/10.1109/EDTM53872.2022.9798171 DO https://doi.org/10.1109/EDTM53872.2022.9798171 SF ELIB - SuUB Bremen
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