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Thermal Challenges for HPC 3DIC Packages and Systems:

, In: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Yan, Kathy ; Lin, Po-Yao ; Kuo, Sheng-Liang - p. 151-153 , 2022
Link: https://doi.org/10.1109/EDTM53872.2022.9798268