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1 Ergebnisse
1
Surface Silicon Bridge Direct Bonded Heterogeneous Integrat..:
, In:
2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
,
Sikka, Kamal
;
Sousa, Isabel De
;
Jain, Aakrati
... - p. 145-147 , 2022
Link:
https://doi.org/10.1109/EDTM53872.2022.9798272
RT T1 <cTitle>2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)</cTitle>: T1 <Title>Surface Silicon Bridge Direct Bonded Heterogeneous Integration (s-DBHi)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9798272&Exemplar=1&LAN=DE A1 Sikka, Kamal A1 Sousa, Isabel De A1 Jain, Aakrati A1 Marushima, Chinami A1 Aoki, Toyohiro A1 Kohara, Sayuri A1 Mori, Hiroyuki A1 Hisada, Takashi YR 2022 K1 Bridges K1 Interference K1 Silicon K1 Manufacturing K1 Copper K1 Substrates K1 Silicon bridge K1 DBHi K1 surface bridge K1 heterogeneous integration) SP 145 OP 147 LK http://dx.doi.org/https://doi.org/10.1109/EDTM53872.2022.9798272 DO https://doi.org/10.1109/EDTM53872.2022.9798272 SF ELIB - SuUB Bremen
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