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Investigation of electrical and thermal behavior of modifie..:

, In: 22nd International Symposium on High Voltage Engineering (ISH 2021),

Awais, M. ; Dai, C. ; Meng, F. B.... - p. None , 2021

Link: https://doi.org/10.1049/icp.2022.0035

RT 
T1 <cTitle>22nd International Symposium on High Voltage Engineering (ISH 2021)</cTitle>: T1 <Title>Investigation of electrical and thermal behavior of modified epoxy structures for DC and high frequency applications</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-9800348&Exemplar=1&LAN=DE
				
A1 Awais, M.
A1 Dai, C.
A1 Meng, F. B.
A1 Paramane, A.
A1 Wang, X.
A1 Chen, X.
YR 2021
K1 curing
K1 dielectric materials
K1 differential scanning calorimetry
K1 electric breakdown
K1 epoxy insulation
K1 epoxy insulators
K1 filled polymers
K1 insulating materials
K1 resins
K1 space charge
K1 stoichiometry
K1 thermal behavior
K1 modified epoxy structures
K1 high frequency applications
K1 epoxy resin insulation
K1 high voltage insulation materials
K1 different curing agent concentrations
K1 thermal properties
K1 high frequency stress
K1 high curing agent concentrations
K1 thermal performance
K1 electrical performance
K1 suitable electrical properties
K1 electrical behavior
SP None
LK http://dx.doi.org/https://doi.org/10.1049/icp.2022.0035
DO https://doi.org/10.1049/icp.2022.0035
SF ELIB - SuUB Bremen

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