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1 Ergebnisse
1
Data reliability of rfid temperature sensor applied to swit..:
, In:
22nd International Symposium on High Voltage Engineering (ISH 2021)
,
Mei, J.
;
Wang, R.
;
Xu, K.
.. - p. None , 2021
Link:
https://doi.org/10.1049/icp.2022.0213
RT T1
22nd International Symposium on High Voltage Engineering (ISH 2021)
: T1
Data reliability of rfid temperature sensor applied to switchgear
UL https://suche.suub.uni-bremen.de/peid=ieee-9800641&Exemplar=1&LAN=DE A1 Mei, J. A1 Wang, R. A1 Xu, K. A1 Dai, Z. A1 Li, J. YR 2021 K1 encapsulation K1 finite element analysis K1 heat transfer K1 radiofrequency identification K1 reliability K1 switchgear K1 temperature distribution K1 temperature measurement K1 temperature sensors K1 data reliability K1 multiphysical field K1 finite element model K1 distribution switchgear K1 heat transfer efficiency K1 sensor encapsulation K1 low voltage switchgear K1 plum contact encapsulation K1 improved temperature sensor encapsulation K1 RFID temperature sensor K1 multiphysical field coupling finite element model SP None LK http://dx.doi.org/https://doi.org/10.1049/icp.2022.0213 DO https://doi.org/10.1049/icp.2022.0213 SF ELIB - SuUB Bremen
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