I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Data reliability of rfid temperature sensor applied to swit..:
, In:
22nd International Symposium on High Voltage Engineering (ISH 2021)
,
Mei, J.
;
Wang, R.
;
Xu, K.
.. - p. None , 2021
Link:
https://doi.org/10.1049/icp.2022.0213
RT T1 <cTitle>22nd International Symposium on High Voltage Engineering (ISH 2021)</cTitle>: T1 <Title>Data reliability of rfid temperature sensor applied to switchgear</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9800641&Exemplar=1&LAN=DE A1 Mei, J. A1 Wang, R. A1 Xu, K. A1 Dai, Z. A1 Li, J. YR 2021 K1 encapsulation K1 finite element analysis K1 heat transfer K1 radiofrequency identification K1 reliability K1 switchgear K1 temperature distribution K1 temperature measurement K1 temperature sensors K1 data reliability K1 multiphysical field K1 finite element model K1 distribution switchgear K1 heat transfer efficiency K1 sensor encapsulation K1 low voltage switchgear K1 plum contact encapsulation K1 improved temperature sensor encapsulation K1 RFID temperature sensor K1 multiphysical field coupling finite element model SP None LK http://dx.doi.org/https://doi.org/10.1049/icp.2022.0213 DO https://doi.org/10.1049/icp.2022.0213 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
