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1 Ergebnisse
1
Thermal-Aware IC Chip Design by Combining High Thermal Cond..:
, In:
2022 5th International Conference on Circuits, Systems and Simulation (ICCSS)
,
Song, Young Suh
;
Tayal, Shubham
;
Rahi, Shiromani Balmukund
... - p. 135-140 , 2022
Link:
https://doi.org/10.1109/ICCSS55260.2022.9802341
RT T1 <cTitle>2022 5th International Conference on Circuits, Systems and Simulation (ICCSS)</cTitle>: T1 <Title>Thermal-Aware IC Chip Design by Combining High Thermal Conductivity Materials and GAA MOSFET</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9802341&Exemplar=1&LAN=DE A1 Song, Young Suh A1 Tayal, Shubham A1 Rahi, Shiromani Balmukund A1 Kim, Jang Hyun A1 Upadhyay, Abhishek Kumar A1 Park, Byung-Gook YR 2022 K1 Integrated circuits K1 Ring oscillators K1 Rapid thermal processing K1 Conductivity K1 Thermal conductivity K1 Reliability engineering K1 Delays K1 Integrated Circuit (IC) Design K1 Thermal-aware Design K1 Thermal Characteristics K1 Thermal Conductivity K1 Low-Power Design K1 Aluminum Oxide SP 135 OP 140 LK http://dx.doi.org/https://doi.org/10.1109/ICCSS55260.2022.9802341 DO https://doi.org/10.1109/ICCSS55260.2022.9802341 SF ELIB - SuUB Bremen
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