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SCIP to the Next Generation of Computing: Extending More th..:

, In: 2022 23rd International Symposium on Quality Electronic Design (ISQED),

Raghunathan, Vivek ; Muth, Karl ; Vinnakota, Bapiraju... - p. 1-6 , 2022

Link: https://doi.org/10.1109/ISQED54688.2022.9806221

RT 
T1 <cTitle>2022 23rd International Symposium on Quality Electronic Design (ISQED)</cTitle>: T1 <Title>SCIP to the Next Generation of Computing: Extending More than Moore with Silicon Photonics Chiplets in Package (SCIP)</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-9806221&Exemplar=1&LAN=DE
				
A1 Raghunathan, Vivek
A1 Muth, Karl
A1 Vinnakota, Bapiraju
A1 Venugopal, Prasad
A1 Schaevitz, Rebecca
A1 Mehta, Manish
YR 2022
SN 1948-3295
K1 Optical interconnections
K1 Memory management
K1 Memory architecture
K1 Graphics processing units
K1 Silicon photonics
K1 Optical network units
K1 Fabrics
K1 Silicon Photonics
K1 Artificial Intelligence (AI) Chips
K1 Machine Learning (ML)
K1 Graphic Processor Unit (GPU) Chips
K1 Chiplets technology
K1 Memory Disaggregation
K1 Multi-Chip Packaging
K1 Advanced Packaging
K1 scale up and scale out networking architectures
SP 1
OP 6
LK http://dx.doi.org/https://doi.org/10.1109/ISQED54688.2022.9806221
DO https://doi.org/10.1109/ISQED54688.2022.9806221
SF ELIB - SuUB Bremen

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