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1 Ergebnisse
1
Passive components facing wideband gap devices' new thermal..:
, In:
2022 International Power Electronics Conference (IPEC-Himeji 2022- ECCE Asia)
,
Fouet, Thomas
;
Dario, Simon
;
Sakuraba, Tomokazu
.. - p. 1164-1170 , 2022
Link:
https://doi.org/10.23919/IPEC-Himeji2022-ECCE53331.202..
RT T1 <cTitle>2022 International Power Electronics Conference (IPEC-Himeji 2022- ECCE Asia)</cTitle>: T1 <Title>Passive components facing wideband gap devices' new thermal and electrical challenges</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9806903&Exemplar=1&LAN=DE A1 Fouet, Thomas A1 Dario, Simon A1 Sakuraba, Tomokazu A1 Suncksen, Herwig A1 de Palma, Jean-Francois YR 2022 K1 Heating systems K1 Inductance K1 Power system measurements K1 Cooling K1 Photonic band gap K1 Thermal management K1 Power electronics K1 Capacitors K1 Low inductance busbar K1 Passive components SP 1164 OP 1170 LK http://dx.doi.org/https://doi.org/10.23919/IPEC-Himeji2022-ECCE53331.2022.9806903 DO https://doi.org/10.23919/IPEC-Himeji2022-ECCE53331.2022.9806903 SF ELIB - SuUB Bremen
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