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1 Ergebnisse
1
Failure Mechanism Investigation of Die-Attach Solder Based ..:
, In:
2022 International Power Electronics Conference (IPEC-Himeji 2022- ECCE Asia)
,
Xu, Zhiliang
;
Ke, Qianxia
;
Ge, Xinglai
.. - p. 139-144 , 2022
Link:
https://doi.org/10.23919/IPEC-Himeji2022-ECCE53331.202..
RT T1 <cTitle>2022 International Power Electronics Conference (IPEC-Himeji 2022- ECCE Asia)</cTitle>: T1 <Title>Failure Mechanism Investigation of Die-Attach Solder Based on the Birth and Death Technology</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9807025&Exemplar=1&LAN=DE A1 Xu, Zhiliang A1 Ke, Qianxia A1 Ge, Xinglai A1 Wang, Huimin A1 Dai, Zongyuan YR 2022 K1 Insulated gate bipolar transistors K1 Temperature K1 Thermal resistance K1 Image edge detection K1 Failure analysis K1 Power electronics K1 Thermal analysis K1 Birth and death technology K1 die-attach solder K1 heat transfer analysis K1 case temperature SP 139 OP 144 LK http://dx.doi.org/https://doi.org/10.23919/IPEC-Himeji2022-ECCE53331.2022.9807025 DO https://doi.org/10.23919/IPEC-Himeji2022-ECCE53331.2022.9807025 SF ELIB - SuUB Bremen
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