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1 Ergebnisse
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Development of reliable multi-chip power modules with paral..:
, In:
2022 IEEE 34th International Symposium on Power Semiconductor Devices and ICs (ISPSD)
,
Fukunaga, Shuhei
;
Castellazzi, Alberto
;
Funaki, Tsuyoshi
- p. 181-184 , 2022
Link:
https://doi.org/10.1109/ISPSD49238.2022.9813624
RT T1
2022 IEEE 34th International Symposium on Power Semiconductor Devices and ICs (ISPSD)
: T1
Development of reliable multi-chip power modules with parallel planar- and trench-gate SiC MOSFETs
UL https://suche.suub.uni-bremen.de/peid=ieee-9813624&Exemplar=1&LAN=DE A1 Fukunaga, Shuhei A1 Castellazzi, Alberto A1 Funaki, Tsuyoshi YR 2022 SN 1946-0201 K1 Temperature dependence K1 MOSFET K1 Temperature distribution K1 Silicon carbide K1 Switching frequency K1 Multichip modules K1 Transportation K1 SiC MOSFETs K1 multi-chip power modules K1 lifetime assessment K1 structure functions SP 181 OP 184 LK http://dx.doi.org/https://doi.org/10.1109/ISPSD49238.2022.9813624 DO https://doi.org/10.1109/ISPSD49238.2022.9813624 SF ELIB - SuUB Bremen
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