I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Large-scale production of boron nitride nanosheets-based ep..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Sun, Zhijian
;
Yu, Michael
;
Li, Jiaxiong
... - p. 1282-1286 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00206
RT T1
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
: T1
Large-scale production of boron nitride nanosheets-based epoxy nanocomposites with ultrahigh through-plane thermal conductivity for electronic encapsulation
UL https://suche.suub.uni-bremen.de/peid=ieee-9816376&Exemplar=1&LAN=DE A1 Sun, Zhijian A1 Yu, Michael A1 Li, Jiaxiong A1 Moran, Macleary A1 Kathaperumal, Mohanalingam A1 Moon, Kyoung-Sik A1 Swaminathan, Madhavan A1 Wong, Ching-Ping YR 2022 SN 2377-5726 K1 Thermal expansion K1 Boron K1 Three-dimensional displays K1 Liquids K1 Thermal resistance K1 Nanocomposites K1 Conductivity K1 2D Materials K1 Boron Nitride K1 Epoxy Nanocomposites K1 Thermal Conductivity K1 Semiconductor Packaging SP 1282 OP 1286 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00206 DO https://doi.org/10.1109/ECTC51906.2022.00206 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)