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1 Ergebnisse
1
Simulation of the Filler Stuck Mechanism in Molding Process..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Chien, Tzu Chieh
;
Lo, Shih Kun
;
Kuo, Yen Hua
... - p. 1798-1804 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00283
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Simulation of the Filler Stuck Mechanism in Molding Process and Verification</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816378&Exemplar=1&LAN=DE A1 Chien, Tzu Chieh A1 Lo, Shih Kun A1 Kuo, Yen Hua A1 Liu, Hui Chung A1 Li, Zong Yuan A1 Lin, Yi Nong A1 Lai, Lu Ming A1 Chen, Kuang Hsiung YR 2022 SN 2377-5726 K1 Vents K1 Predictive models K1 Logic gates K1 Conductivity K1 Electromagnetic compatibility K1 Thermal conductivity K1 Filling K1 Particle K1 Filler stuck K1 Filler concentration K1 Air trap K1 Unfilled K1 Clogging SP 1798 OP 1804 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00283 DO https://doi.org/10.1109/ECTC51906.2022.00283 SF ELIB - SuUB Bremen
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