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1 Ergebnisse
1
Analysis of Pattern Distortion by Panel Deformation and Add..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Chang, John
;
Shay, Corey
;
Webb, James
. - p. 1505-1510 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00240
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Analysis of Pattern Distortion by Panel Deformation and Addressing it by Using Extremely Large Exposure Field Fine-Resolution Lithography</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816380&Exemplar=1&LAN=DE A1 Chang, John A1 Shay, Corey A1 Webb, James A1 Chang, Timothy YR 2022 SN 2377-5726 K1 Lithography K1 Packaging K1 Distortion K1 Silicon K1 Internet of Things K1 Artificial intelligence K1 Task analysis K1 5G K1 HPC K1 AI K1 IoT K1 Heterogeneous Integration (HI) K1 Advanced IC Substrate (AICS) K1 Advanced Packaging (AP) K1 OSAT K1 Fan-out Panel-level Packaging (FOPLP) K1 Overlay K1 Large Exposure Field K1 Fine Resolution SP 1505 OP 1510 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00240 DO https://doi.org/10.1109/ECTC51906.2022.00240 SF ELIB - SuUB Bremen
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