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1 Ergebnisse
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Assembly challenges and demonstrations of ultra-large Anten..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Lim, Sharon Pei Siang
;
Chong, Ser Choong
;
Wee, David Ho Soon
. - p. 635-642 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00107
RT T1
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
: T1
Assembly challenges and demonstrations of ultra-large Antenna in Package for Automotive Radar applications
UL https://suche.suub.uni-bremen.de/peid=ieee-9816381&Exemplar=1&LAN=DE A1 Lim, Sharon Pei Siang A1 Chong, Ser Choong A1 Wee, David Ho Soon A1 Chai, Tai Chong YR 2022 SN 2377-5726 K1 Radio frequency K1 Microwave antennas K1 Surface mount technology K1 Packaging K1 Radar antennas K1 Microwave circuits K1 Radar applications K1 Fan-out wafer level packaging K1 Antenna in package K1 die shift K1 wafer level molding K1 ultra-large FOWLP SP 635 OP 642 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00107 DO https://doi.org/10.1109/ECTC51906.2022.00107 SF ELIB - SuUB Bremen
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