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1
The Effects of Bi Doping and Aging on Viscoplasticity of Sn..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Shukla, Vishnu
;
Ayers, Nicholas
;
Moreno, Andrea
... - p. 1687-1694 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00266
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>The Effects of Bi Doping and Aging on Viscoplasticity of Sn-Ag-Cu-Bi alloys</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816383&Exemplar=1&LAN=DE A1 Shukla, Vishnu A1 Ayers, Nicholas A1 Moreno, Andrea A1 Crutchfield, Natalie A1 Lyons, Devin A1 Ahmed, Omar A1 Su, Peng A1 Glasauer, Bernard A1 Jiang, Tengfei YR 2022 SN 2377-5726 K1 Conferences K1 Semiconductor device reliability K1 Metals K1 Electronic components K1 Doping K1 Materials reliability K1 Aging K1 viscoplasticity K1 Anand parameters K1 constant strain rate tensile test SP 1687 OP 1694 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00266 DO https://doi.org/10.1109/ECTC51906.2022.00266 SF ELIB - SuUB Bremen
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