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1 Ergebnisse
1
High Thermal Graphite TIM Solution Applied to Fan-Out Platf..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Su, Pin-Jing
;
Lin, Dan
;
Lin, Shane
... - p. 1224-1227 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00196
RT T1
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
: T1
High Thermal Graphite TIM Solution Applied to Fan-Out Platform
UL https://suche.suub.uni-bremen.de/peid=ieee-9816385&Exemplar=1&LAN=DE A1 Su, Pin-Jing A1 Lin, Dan A1 Lin, Shane A1 Xu, Xi-Zhang A1 Lin, Rung Jeng A1 Hung, Liang-Yih A1 Wang, Yu-Po YR 2022 SN 2377-5726 K1 Heating systems K1 Temperature sensors K1 Graphite K1 Conductivity K1 Thermal conductivity K1 Electromagnetic compatibility K1 Silicon K1 HPC K1 Fan-out K1 Graphite TIM K1 Vertical Thermal Conductivity SP 1224 OP 1227 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00196 DO https://doi.org/10.1109/ECTC51906.2022.00196 SF ELIB - SuUB Bremen
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