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1 Ergebnisse
1
Panel Level Packaging – Where are the Technology Limits?:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Braun, Tanja
;
Holck, Ole
;
Obst, Mattis
... - p. 807-818 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00133
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Panel Level Packaging – Where are the Technology Limits?</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816387&Exemplar=1&LAN=DE A1 Braun, Tanja A1 Holck, Ole A1 Obst, Mattis A1 Voges, Steve A1 Kahle, Ruben A1 Bottcher, Lars A1 Billaud, Mathilde A1 Stobbe, Lutz A1 Becker, Karl-Friedrich A1 Aschenbrenner, Rolf A1 Voitel, Marcus A1 Schein, Friedrich-Leonhard A1 Gerholt, Lutz A1 Schneider-Ramelow, Martin YR 2022 SN 2377-5726 K1 Temperature sensors K1 Radio frequency K1 Shape K1 Process control K1 Packaging K1 Predictive models K1 Market research K1 Fan-out Panel Level Packaging K1 Warpage K1 Die Shift K1 Fine-Line RDL K1 Environmental Modelling SP 807 OP 818 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00133 DO https://doi.org/10.1109/ECTC51906.2022.00133 SF ELIB - SuUB Bremen
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