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1 Ergebnisse
1
Realization of high A/R and fine pitch Cu pillars incorpora..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Park, Se-Chul
;
Park, Jong-Ho
;
Bae, Seonghoon
... - p. 1005-1009 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00164
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Realization of high A/R and fine pitch Cu pillars incorporating high speed electroplating with novel strip process</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816388&Exemplar=1&LAN=DE A1 Park, Se-Chul A1 Park, Jong-Ho A1 Bae, Seonghoon A1 Park, Junyoung A1 Jung, Taehwa A1 Yun, Hyojin A1 Jeong, Kwangok A1 Park, Seok-Bong A1 Choi, Ju-Il A1 Kang, Un-Byoung A1 Kang, Dongwoo YR 2022 SN 2377-5726 K1 Electrochemical deposition K1 Fabrication K1 Strips K1 Three-dimensional displays K1 Surface morphology K1 Resists K1 Plating K1 FOWLP K1 Cu Pillar K1 high speed electroplating SP 1005 OP 1009 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00164 DO https://doi.org/10.1109/ECTC51906.2022.00164 SF ELIB - SuUB Bremen
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