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Multi-layer FCCSP organic packaging for D-band millimeter w..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Gaunkar, N. Prabhu ; Dogiamis, G. ; Kamgaing, T... - p. 365-370 , 2022
Link: https://doi.org/10.1109/ECTC51906.2022.00067