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1 Ergebnisse
1
Process and Design Optimization for Hybrid Cu Bonding Void:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Kim, Hyoeun
;
Kim, Juhyeon
;
Kim, Yeongseon
... - p. 194-197 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00041
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Process and Design Optimization for Hybrid Cu Bonding Void</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816392&Exemplar=1&LAN=DE A1 Kim, Hyoeun A1 Kim, Juhyeon A1 Kim, Yeongseon A1 Seo, Sun-Kyoung A1 Jo, Chajea A1 Kim, Dae-Woo YR 2022 SN 2377-5726 K1 Productivity K1 Three-dimensional displays K1 Process control K1 Silicon K1 Topology K1 Bonding K1 Surface treatment K1 component K1 hybrid cu bonding K1 interconnection SP 194 OP 197 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00041 DO https://doi.org/10.1109/ECTC51906.2022.00041 SF ELIB - SuUB Bremen
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