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1 Ergebnisse
1
Solder Joint Fatigue Studies Subjected to Board-level Rando..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Khaldarov, Valeriy
;
Zhang, Andy
;
Xie, Dongji
... - p. 1777-1784 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00280
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Solder Joint Fatigue Studies Subjected to Board-level Random Vibration for Automotive Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816399&Exemplar=1&LAN=DE A1 Khaldarov, Valeriy A1 Zhang, Andy A1 Xie, Dongji A1 Lee, Jeffrey A1 Shi, Xue A1 Roucou, Romuald A1 Doranga, Sushil A1 Shalumov, Alexander YR 2022 SN 2377-5726 K1 Vibrations K1 Industries K1 Simulation K1 Printed circuits K1 Fatigue K1 Finite element analysis K1 Microelectronics K1 JEDEC K1 random vibration K1 printed circuit board assembly K1 SAC305 solder joints K1 high- and ultra-high-cycle fatigue K1 reusable electronics K1 S-N fatigue curves SP 1777 OP 1784 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00280 DO https://doi.org/10.1109/ECTC51906.2022.00280 SF ELIB - SuUB Bremen
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