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1 Ergebnisse
1
Demonstration of Fan-out Silicon Photonics Module for Next ..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Chou, Bruce
;
Sawyer, Brett M.
;
Lyu, Gap
... - p. 394-402 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00071
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Demonstration of Fan-out Silicon Photonics Module for Next Generation Co-Packaged Optics (CPO) Application</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816401&Exemplar=1&LAN=DE A1 Chou, Bruce A1 Sawyer, Brett M. A1 Lyu, Gap A1 Timurdugan, Erman A1 Minkenberg, Cyriel A1 Zilkie, Aaron J. A1 McCann, David YR 2022 SN 2377-5726 K1 Integrated optics K1 Costs K1 Optical switches K1 Packaging K1 Adaptive optics K1 Flip-chip devices K1 Signal integrity K1 Co-packaged optics K1 silicon photonics K1 wafer-level fan-out K1 elastomer socket SP 394 OP 402 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00071 DO https://doi.org/10.1109/ECTC51906.2022.00071 SF ELIB - SuUB Bremen
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