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1 Ergebnisse
1
3-Layer Stacking Technology with Pixel-Wise Interconnection..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Goto, Masahide
;
Honda, Yuki
;
Nanba, Masakazu
... - p. 122-125 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00029
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>3-Layer Stacking Technology with Pixel-Wise Interconnections for Image Sensors Using Hybrid Bonding of Silicon-on-Insulator Wafers Mediated by Thin Si Layers</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816403&Exemplar=1&LAN=DE A1 Goto, Masahide A1 Honda, Yuki A1 Nanba, Masakazu A1 Iguchi, Yoshinori A1 Higurashi, Eiji A1 Saraya, Takuya A1 Kobayashi, Masaharu A1 Toshiyoshi, Hiroshi A1 Hiramoto, Toshiro YR 2022 SN 2377-5726 K1 Image sensors K1 Three-dimensional displays K1 Conferences K1 Stacking K1 Silicon-on-insulator K1 Electronic components K1 Nonhomogeneous media K1 3D integration K1 image sensor K1 hybrid bonding K1 silicon-on-insulator (SOI) SP 122 OP 125 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00029 DO https://doi.org/10.1109/ECTC51906.2022.00029 SF ELIB - SuUB Bremen
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