I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Optimizing Reflowed Solder TIM (sTIMs) Processes for Emergi..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Lee, D.W.
;
Mayberry, Ryan
;
Mackie, Andy
... - p. 1228-1237 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00197
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816406&Exemplar=1&LAN=DE A1 Lee, D.W. A1 Mayberry, Ryan A1 Mackie, Andy A1 Hable, Bret A1 Heller, David A1 Jarrett, Bob A1 Zhao, Xike A1 Nash, Tom YR 2022 SN 2377-5726 K1 Liquids K1 Thermal resistance K1 Thermomechanical processes K1 Graphics processing units K1 Vacuum technology K1 Thermal conductivity K1 Complexity theory K1 Thermal Interface Materials K1 TIM K1 indium K1 metal TIM K1 solder TIM K1 sTIM K1 heat transfer K1 thermal resistance SP 1228 OP 1237 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00197 DO https://doi.org/10.1109/ECTC51906.2022.00197 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
