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1 Ergebnisse
1
A Parameter Study for the Design Optimization to Relieve Pa..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Noh, Hyunggyun
;
Lee, Kyungwoo
;
Bae, Jinsu
... - p. 1754-1758 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00276
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Parameter Study for the Design Optimization to Relieve Pattern Stress of PCB under the Temperature Cycling Condition</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816410&Exemplar=1&LAN=DE A1 Noh, Hyunggyun A1 Lee, Kyungwoo A1 Bae, Jinsu A1 Hwang, Yuchul A1 Kim, Hoosung A1 Pae, Sangwoo YR 2022 SN 2377-5726 K1 Temperature K1 Correlation K1 Parametric study K1 Conferences K1 Thermomechanical processes K1 Electronic components K1 Numerical simulation K1 Thermo-mechanical stress K1 Pattern width K1 Pattern direction K1 Module PCB K1 Temperature Cycling SP 1754 OP 1758 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00276 DO https://doi.org/10.1109/ECTC51906.2022.00276 SF ELIB - SuUB Bremen
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