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Cu-SiO2 Hybrid Bonding Yield Enhancement Through Cu Grain E..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Murugesan, M. ; Mori, K. ; Sawa, M.... - p. 685-690 , 2022
Link: https://doi.org/10.1109/ECTC51906.2022.00115