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Functional Testing of AI Cores through Thinned 3D I/O Buffe..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),

Farooq, Mukta ; Kumar, Arvind ; Lee, Sae-Kyu... - p. 977-980 , 2022

Link: https://doi.org/10.1109/ECTC51906.2022.00159

RT 
T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-9816418&Exemplar=1&LAN=DE
				
A1 Farooq, Mukta
A1 Kumar, Arvind
A1 Lee, Sae-Kyu
A1 Bonam, Ravi
A1 Gomez, Juan-Manuel
A1 Kelly, James
A1 Hosokawa, Kohji
A1 Nomura, Akiyo
A1 Kohda, Yasuteru
A1 Dickson, Timothy
A1 Sakuma, Katsuyuki
A1 Mori, Hiroyuki
A1 Rubin, Joshua
A1 Saraf, Iqbal
A1 Pai, Vinay
A1 Nieves, Pablo
A1 Li, Yandong
A1 DelaPena, Abraham
A1 Wassick, Thomas
A1 Perfecto, Eric
A1 Carr, Christopher
A1 Sardesai, Viraj
A1 Miller, Eric
A1 Oakley, Jennifer
A1 Skordas, Spyridon
A1 Teehan, Sean
A1 McHerron, Dale
A1 Burns, Jeff
A1 Divakaruni, Rama
YR 2022
SN 2377-5726
K1 Three-dimensional displays
K1 System performance
K1 Stacking
K1 Packaging
K1 Silicon
K1 Artificial intelligence
K1 Through-silicon vias
K1 AI
K1 Functional testing
K1 TSV integration
K1 3D die stacking
SP 977
OP 980
LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00159
DO https://doi.org/10.1109/ECTC51906.2022.00159
SF ELIB - SuUB Bremen

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