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1 Ergebnisse
1
Genetic Algorithm–Assisted Design of Redistribution Layer V..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Fan, Jiajie
;
Qian, Yichen
;
Chen, Wei
... - p. 260-265 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00049
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816424&Exemplar=1&LAN=DE A1 Fan, Jiajie A1 Qian, Yichen A1 Chen, Wei A1 Jiang, Jing A1 Tang, Zhuorui A1 Fan, Xuejun A1 Zhang, Guoqi YR 2022 SN 2377-5726 K1 Heating systems K1 MOSFET K1 Silicon carbide K1 Multichip modules K1 Electronic packaging thermal management K1 Thermal management K1 Reliability engineering K1 SiC MOSFET K1 FOPLP K1 ACO-BPNN K1 NSGA-II K1 Reliability optimization SP 260 OP 265 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00049 DO https://doi.org/10.1109/ECTC51906.2022.00049 SF ELIB - SuUB Bremen
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