I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Die to Wafer Hybrid Bonding for Chiplet and Heterogeneous I..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Gao, Guilian
;
Mirkarimi, Laura
;
Fountain, Gill
... - p. 1975-1981 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00310
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Die to Wafer Hybrid Bonding for Chiplet and Heterogeneous Integration: Die Size Effects Evaluation-Small Die Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816427&Exemplar=1&LAN=DE A1 Gao, Guilian A1 Mirkarimi, Laura A1 Fountain, Gill A1 Suwito, Dominik A1 Theil, Jeremy A1 Workman, Thomas A1 Uzoh, Cyprian A1 Lee, Bongsub A1 Bang, K.M. A1 Guevara, Gabe YR 2022 SN 2377-5726 K1 Temperature sensors K1 Scanning electron microscopy K1 Temperature distribution K1 Annealing K1 Microscopy K1 Random access memory K1 Solids K1 Cu-Cu hybrid bonding K1 direct bond interconnect (DBI) K1 DBI Ultra K1 hybrid bonding K1 D2W K1 D2D K1 small die K1 dicing K1 die-on-tape processing SP 1975 OP 1981 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00310 DO https://doi.org/10.1109/ECTC51906.2022.00310 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
