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1 Ergebnisse
1
Physics-based Nested-ANN Approach for Fan-Out Wafer-Level P..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Yao, Peilun
;
Yang, Jun
;
Zhang, Yonglin
... - p. 1827-1833 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00287
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Physics-based Nested-ANN Approach for Fan-Out Wafer-Level Package Reliability Prediction</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816435&Exemplar=1&LAN=DE A1 Yao, Peilun A1 Yang, Jun A1 Zhang, Yonglin A1 Fan, Xiaoshun A1 Chen, Haibin A1 Yang, Jinglei A1 Wu, Jingshen YR 2022 SN 2377-5726 K1 Semiconductor device modeling K1 Computational modeling K1 System performance K1 Semiconductor device reliability K1 Predictive models K1 Electromagnetic compatibility K1 Data models K1 Physics-based machine learning K1 nested-artificial neural network K1 fan-out wafer-level package K1 finite element modeling K1 reliability SP 1827 OP 1833 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00287 DO https://doi.org/10.1109/ECTC51906.2022.00287 SF ELIB - SuUB Bremen
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