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1 Ergebnisse
1
Effects of Temperature on the Adhesive Performance of High ..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Zhao, Guolin
;
Yang, Yuanyuan
;
Peng, Xiaohui
... - p. 2275-2280 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00359
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Effects of Temperature on the Adhesive Performance of High Tg Underfill in 2.5D Heterogeneous Integrated Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816436&Exemplar=1&LAN=DE A1 Zhao, Guolin A1 Yang, Yuanyuan A1 Peng, Xiaohui A1 Wu, Houya A1 Lin, Haoliang A1 Li, Gang A1 Zhu, Pengli A1 Sun, Rong A1 Wong, Chingping A1 Zhu, Wenhui YR 2022 SN 2377-5726 K1 Temperature measurement K1 Couplings K1 Temperature dependence K1 Temperature K1 Adhesive strength K1 Adhesives K1 Glass K1 underfill K1 heterogeneous packaging K1 interfacial adhesion K1 High Tg underfill SP 2275 OP 2280 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00359 DO https://doi.org/10.1109/ECTC51906.2022.00359 SF ELIB - SuUB Bremen
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