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1 Ergebnisse
1
Thermo-Mechanical Reworkable Epoxy Underfill in Board-Level..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Lip Teng, Saw
;
Devarajan, Mutharasu
- p. 1750-1753 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00275
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Thermo-Mechanical Reworkable Epoxy Underfill in Board-Level Package: Material Characteristics and Reliability Criteria</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816442&Exemplar=1&LAN=DE A1 Lip Teng, Saw A1 Devarajan, Mutharasu YR 2022 SN 2377-5726 K1 Viscosity K1 Vibrations K1 Thermal expansion K1 Temperature K1 Adhesives K1 Thermomechanical processes K1 Electronic packaging thermal management K1 Underfill K1 glass transition temperature K1 coefficient of thermal expansion K1 storage modulus K1 adhesion strength K1 reliability SP 1750 OP 1753 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00275 DO https://doi.org/10.1109/ECTC51906.2022.00275 SF ELIB - SuUB Bremen
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