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1 Ergebnisse
1
Investigation Of Stress Generated By Interconnection Proces..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Liu, E
;
Bhogaraju, Sri Krishna
;
Lux, Kerstin
.. - p. 739-745 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00123
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Investigation Of Stress Generated By Interconnection Processes With Micro-Raman Spectroscopy (μRS)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816447&Exemplar=1&LAN=DE A1 Liu, E A1 Bhogaraju, Sri Krishna A1 Lux, Kerstin A1 Elger, Gordon A1 Mou, Rokeya Mumtahana YR 2022 SN 2377-5726 K1 Semiconductor device measurement K1 Analytical models K1 Spectroscopy K1 Thermomechanical processes K1 Sintering K1 Acoustic measurements K1 Stress K1 component K1 μ-Raman Spectroscopy K1 Au80Sn20 K1 Cu sintering K1 finite element simultion SP 739 OP 745 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00123 DO https://doi.org/10.1109/ECTC51906.2022.00123 SF ELIB - SuUB Bremen
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