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Demonstration of flexible encapsulation in assembly industr:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Liu, Chao-Wei ; Chen, Ming-Hung ; Pi, Tun-Ching.. - p. 987-991 , 2022
Link: https://doi.org/10.1109/ECTC51906.2022.00161