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Direct Bonding Using Low Temperature SiCN Dielectrics:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Iacovo, Serena ; Nagano, Fuya ; Channam, Venkat Sunil Kumar... - p. 602-607 , 2022
Link: https://doi.org/10.1109/ECTC51906.2022.00101