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1 Ergebnisse
1
Mechanical and Thermal Characterization Analysis of Chip-la..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Yin, Wei-Jie
;
Lai, Wei-Hong
;
Lu, Ying-Xu
... - p. 1711-1719 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00269
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Mechanical and Thermal Characterization Analysis of Chip-last Fan-out Chip on Substrate</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816467&Exemplar=1&LAN=DE A1 Yin, Wei-Jie A1 Lai, Wei-Hong A1 Lu, Ying-Xu A1 Chen, Karen Y.U. A1 Huang, Hung-Hsien A1 Chen, Tang-Yuan A1 Kao, Chin-Li A1 Hung, C.P. YR 2022 SN 2377-5726 K1 Temperature measurement K1 Analytical models K1 Thermal resistance K1 Thermal conductivity K1 Thermal analysis K1 Device-to-device communication K1 Numerical models K1 fan-out K1 FOCoS-CL K1 warpage K1 stress K1 aMA K1 RDL K1 thermal characteristic SP 1711 OP 1719 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00269 DO https://doi.org/10.1109/ECTC51906.2022.00269 SF ELIB - SuUB Bremen
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