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1 Ergebnisse
1
Pressureless and low temperature sintering by Ag paste for ..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Wang, Chuncheng
;
Zhang, Xu
;
Zhang, Yudui
... - p. 2256-2262 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00356
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Pressureless and low temperature sintering by Ag paste for the high temperature die-attachment in power device packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816478&Exemplar=1&LAN=DE A1 Wang, Chuncheng A1 Zhang, Xu A1 Zhang, Yudui A1 Zhao, Tao A1 Zhu, Pengli A1 Sun, Rong A1 Nishikawa, Hiroshi A1 Xu, Liang YR 2022 SN 2377-5726 K1 Solvents K1 Temperature K1 Photonic band gap K1 Sintering K1 Electronic components K1 Packaging K1 Hybrid power systems K1 Pressureless sintering K1 Sintering proflie K1 High shear strength SP 2256 OP 2262 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00356 DO https://doi.org/10.1109/ECTC51906.2022.00356 SF ELIB - SuUB Bremen
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